PRODUCT RANGE
- Buffers
- Isolators & Stop Buffers
- Wasted buffers
- Special buffer
- Rails & Rectangular Mountings
- Device Mountings
- Bearings & Bushes
- Cone Mountings & Compression springs
- Special Mountings
- Interleaf Springs & Wasted Mountings
GENERAL FEATURES
- Designed as per customer requirements
- Moulding by transfer and injection method
- Metal treatment by mechanical (shot blasting) and chemical (phosphate) method
- Bonding with any type of metal like MS, SS, Aluminum, Brass etc
- Use of branded bonding agent like chemlok, thixon, megum
- Use of any polymer like NR, SBR, CR, EPDM, PU, Silicon, NBR, depending on application
- Properties and performances(bond strength, load deflection, endurance, dynamic mechanical properties,(physical properties) are tested as per international standards like SAE, BS, JIS, ASTM, IS
