• Buffers
  • Isolators & Stop Buffers
  • Wasted buffers
  • Special buffer
  • Rails & Rectangular Mountings
  • Device Mountings
  • Bearings & Bushes
  • Cone Mountings & Compression springs
  • Special Mountings
  • Interleaf Springs & Wasted Mountings


  • Designed as per customer requirements
  • Moulding by transfer and injection method
  • Metal treatment by mechanical (shot blasting) and chemical (phosphate) method
  • Bonding with any type of metal like MS, SS, Aluminum, Brass etc
  • Use of branded bonding agent like chemlok, thixon, megum
  • Use of any polymer like NR, SBR, CR, EPDM, PU, Silicon, NBR, depending on application
  • Properties and performances(bond strength, load deflection, endurance, dynamic mechanical properties,(physical properties) are tested as per international standards like SAE, BS, JIS, ASTM, IS